Originalbeitrag in Fachzeitschrift
Multi-physics simulation of adhesives for structural joints in hygrothermal environments considering mechanical degradation
YL W, A C, J V, P S, J B, HC L, et al. Multi-physics simulation of adhesives for structural joints in hygrothermal environments considering mechanical degradation. Composite Structures. 2025;357:118928. doi:https://doi.org/10.1016/j.compstruct.2025.118928
Externe Links und Eigenschaften der Publikation:
BOKU Autor*innen
Philipp Siedlaczek
Dipl.-Ing.Dr. Philipp Siedlaczek
Helga Lichtenegger
Univ.Prof. Mag.Dr.rer.nat. Helga Lichtenegger
