Journal articles
Technological performance of formaldehyde-free adhesive alternatives for particleboard industry
Solt P, Konnerth J, Gindl-Altmutter W, Kantner W, Moser J, Mitter R, et al. Technological performance of formaldehyde-free adhesive alternatives for particleboard industry. International Journal of adhesion and adhesives [Internet]. 2019;94:99-131. doi:10.1016/j.ijadhadh.2019.04.007
Externe Links und Eigenschaften der Publikation:
BOKU Autor*innen
Hendrikus Van Herwijnen
Dr. Hendrikus Van Herwijnen
Wolfgang Gindl-Altmutter
Univ.Prof. Dipl.-Ing.Dr.nat.techn. Wolfgang Gindl-Altmutter
Johannes Konnerth
Univ.Prof. Dipl.-Ing.Dr. Johannes Konnerth
Pia Solt-Rindler
Dipl.-Ing.Dr. Pia Solt-Rindler
