Conference & Workshop proceedings, paper, abstract
Low Temperature Adhesive Bonding for Structural Wood Materials
Tran A, Mayr M, Konnerth J, Gindl-Altmutter W. Low Temperature Adhesive Bonding for Structural Wood Materials. In: LeVan-Green S , editor. Proceedings of the 2020 Society of Wood Science and Technology International Convention. 2020.
BOKU Autors
Wolfgang Gindl-Altmutter
Univ.Prof. Dipl.-Ing. Dr.nat.techn. Wolfgang Gindl-Altmutter
Johannes Konnerth
Univ.Prof. Dipl.-Ing. Dr. Johannes Konnerth
Melanie Mayr
Dipl.-Ing. Dr.techn. Melanie Mayr B.Sc.
Anita Tran
Dr.nat.techn. Anita Tran MSc.