Journal articles
Optimizing Epoxy Molding Compound Processing: A Multi-Sensor Approach to Enhance Material Characterization and Process Reliability.
Vogelwaid J, Bayer M, Walz M, Hampel F, Kutuzova L, Lorenz G, et al. Optimizing Epoxy Molding Compound Processing: A Multi-Sensor Approach to Enhance Material Characterization and Process Reliability. Polymers. 2024;16(11):1540. doi:10.3390/polym16111540
Externe Links und Eigenschaften der Publikation:
BOKU Autor*innen
Andreas Kandelbauer
Priv.Doz.DI Dr.nat.techn. Andreas Kandelbauer