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Anita Tran

Dr.nat.techn. Anita Tran M.Sc.
Institute of Wood Technology and Renewable Materials
Location Konrad Lorenz-Straße 24, 3430 Tulln an der Donau
Email anita.tran@boku.ac.at
Tel: +43 1 47654-89160

ORCID: https://orcid.org/0000-0002-7141-9998

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    Lectures

    • Year: 2024 -  Mechanical treatments of plant proteins for their utilization as wood adhesives

      Autoren: Malik, R; Konnerth, J; Van Herwijnen, H; Tran, A

      Event: 67th SWST International Convention 2024

    • Year: 2024 -  Wood adhesives based on proteins

      Autoren: Malik, R; Gabler, C; Tran, A; Konnerth, J; Van Herwijnen, H

      Event: Österreichische Chemietage 2024

    • Year: 2024 -  Effects of chemical denaturation and mechanical homogenization of plant proteins

      Autoren: Rohrhuber, S; Malik, R; Van Herwijnen H; Konnerth, J; Tran, A

      Event: 67th SWST International Convention 2024

    • Year: 2024 -  Electrical and Mechanical Characterisation of Adhesive Functionalised with Electrically Conductive Fillers

      Autoren: Suarez, S; Konnerth, J; Vasiljevic, M; Riegler, M; Tran, A

      Event: 67th SWST International Convention 2024

    • Year: 2023 -  Impedance Spectroscopy for Monitoring the Condition of Wooden Components

      Autoren: Vasiljevic, M; Sinn, G; Celine Suarez, S; Gupta, N; Lichtenegger, H

      Event: International Workshop on Impedance Spectroscopy

    • Year: 2022 -  Temperature and moisture dependent rheological cure characterization of wood adhesive

      Autoren: Tran, A; Konnerth, J; Gindl-Altmutter W

      Event: International Conference on Wood Adhesives 2022

    • Year: 2021 -  Adhesive strength for structural wood applications bonded at low temperature

      Autoren: Tran, A; Mayr M.; Konnerth, J; Gindl-Altmutter W

      Event: 6th International Conference on Structural Adhesive Bonding AB 2021

    • Year: 2021 -  Temperature and moisture dependent curing behavior with rheological method for wood

      Autoren: Tran, A; Konnerth, J; Gindl-Altmutter, W

      Event: Salzburg Conference for Smart Materials 2021

    • Year: 2020 -  Low Temperature Adhesive Bonding for Structural Wood Materials

      Autoren: Tran, A; Mayr, M; Konnerth, J; Gindl-Altmutter, W

      Event: SWST International Convention 2020

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