Stepan Hysek

Presentations

• Year: 2024 -  Development of an innovative powder adhesive based on epoxy-polyester and lignin for production of particleboards (Lecture)

  Autoren: Němec, M; Pipíška, T; Hájková, K; Král, P; Hýsek, Š

  Event: 27th International Conference on Composite Structures 2024

  Period: 03.09.2024 - 06.09.2024  | Location: Bologna, Italien  | Organizer: UNIVERSITY OF BOLOGNA

• Year: 2024 -  Mycelium of medicinal mushrooms for production of mycelium-based bio-composites and its physical and mechanical properties (Vortrag)

  Autoren: Hýsek, Š; Jozífek, M; Hradecký, J; Němec, M; Wimmer, R

  Event: 12th International Medicinal Mushrooms Conference 2024

  Period: 24.09.2024 - 27.09.2024  | Location: Bari, Bari, Italien  | Organizer: University of Bari

• Year: 2024 -  Mycelium-based composites from recycled wood: heat insulation materials with low VOC emissions (Poster)

  Autoren: Hýsek, Š; Hradecký, J; Jozífek, M; Němec, M, Wimmer, R

  Event: 67th SWST International Convention 2024

  Period: 30.06.2024 - 05.07.2024  | Location: Portoroz, SLOVENIA  | Organizer: Society of Wood Science and Technology | Organizer: University of Primorska

• Year: 2023 -  Mycelium-based biocomposites from recycled wood: influence of fungal species on properties of biocomposites (Vortrag)

  Autoren: Hýsek, Š; Daňková, M; Jozífek, M; Němec, M; Wimmer, R

  Event: 32th International Conference on Wood Science and Technology - ICWST 2023

  Period: 07.12.2023 - 08.12.2023  | Location: Zagreb, CROATIA