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Search Items: Low temperature curing, . hits: 1

** = Publications listed in SCI/SSCI - Journals (published in Web of Science)
* = peer-reviewed publication (not listed in SCI/SSCI)
Only: Full paper/article, Review, Proceedings Paper

2022

** Tran, A; Konnerth, J; van Herwijnen, HWG; Gindl-Altmutter, W Low temperature and moisture dependent curing behavior of selected wood adhesives.

INT J ADHES ADHES. 2022; 117, 103178 WoS FullText FullText_BOKU