BOKU - Universität für Bodenkultur Wien - Forschungsinformationssystem

Logo BOKU-Forschungsportal

Gewählte Publikation:

Rosenfeld, C; Sailer-Kronlachner, W; Konnerth, J; Sol-Rindler, P; Pellis, A; Rosenau, T; Potthast, A; van Herwijnen, HWG.
(2022): Hydroxymethylfurfural: A key to increased reactivity and performance of fructose-based adhesives for particle boards
IND CROP PROD. 2022; 187, 115536 FullText FullText_BOKU

Abstract:
There is a push towards the use of renewable adhesives in particle board manufacturing industry. A remaining barrier for the successful implementation of carbohydrate-based adhesives is the necessity of a rapid cure behavior at lower temperatures (105-120 degrees C). The aim of this work was to study the effect of highly reactive, bio-based 5-Hydroxymethylfurfural (HMF) on the cure speed in fructose-bishexamethylenetriamine (BHMT) adhesive. The technological suitability of these adhesives for the intended application in particle boards was done by combining adhesive characterization with thermal analysis and tensile shear strength development. Overall, HMF had a strong, positive effect on the reactivity and performance of these fructose-based adhesives, especially at lower hot-press temperatures. The tensile shear strength development of fructose/HMF/BHMT adhesives was comparable to commercial, fossil-based urea-formaldehyde resin at 120 degrees C. A sufficient tensile shear strength of 5.0 +/- 0.3 N/mm(2) was reached after press times as low as 30 s and 6.2 +/- 0.1 N/mm(2) after pressing for 150 s at 105 degrees C. This suggests fructose-HMF-BHMT adhesives have sufficient reactivity and performance and as such are a promising adhesive for a cleaner production of particle boards. Their rapid cure behavior is among the best of previously reported HMF-based adhesives.
Autor*innen der BOKU Wien:
Konnerth Johannes
Pellis Alessandro
Potthast Antje
Rosenau Thomas
Sailer-Kronlachner Wilfried
Van Herwijnen Hendrikus
BOKU Gendermonitor:


Find related publications in this database (Keywords)
Adhesion
Cure behavior
Mechanical properties
Hydroxymethylfurfural


Altmetric:
© BOKU Wien Impressum