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Gewählte Publikation:

Konnerth, J., Gindl, W..
(2006): The interphase in wood-adhesive bond lines by nanoindentation
Holzforschung, 60, 429-433 FullText FullText_BOKU

Abstract:
The elastic modulus, hardness, and creep factor of wood cell walls in the interphase region of four different adhesive bonds were determined by nanoindentation. In comparison with reference cell walls unaffected by adhesive, interphase cell walls from melamine-urea-formaldehyde (MUF) and phenol-resorcinol-formaldehyde (PRF) adhesive bonds showed improved hardness and reduced creep, as well as improved elastic modulus in the case of MUF. In contrast, cell walls from the interphase region in polyvinylacetate (PVAc) and one-component polyurethane (PUR) bonds showed more creep, but lower elastic modulus and hardness than the reference. Considering the different cell-wall penetration behaviour of the adhesive polymers studied here, it is concluded that damage and loss of elastic modulus to surface cells occurring during the machining of wood is recovered in MUF and PRF bond lines, whereas damage of cell walls persists in PVAc and PUR bond lines.
Autor/innen der BOKU Wien:
Gindl-Altmutter Wolfgang
Konnerth Johannes
BOKU Gendermonitor:


Find related publications in this database (Keywords)
adhesive diffusion
bond line
cell wall properties
interphase
mechanical characterisation
nano-indentation


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