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Selected Publication:

Tran, A; Mayr, M; Konnerth, J; Gindl-Altmutter, W.
(2020): Adhesive strength and micromechanics of wood bonded at low temperature
INT J ADHES ADHES. 2020; 103, 102697 FullText FullText_BOKU

Authors BOKU Wien:: Gindl-Altmutter Wolfgang; Konnerth Johannes; Mayr Melanie; Tran Anita
BOKU Gendermonitor:
Find related publications in this database (Keywords): Adhesives for wood; Wood and wood composites; Cure / hardening; Adhesive bond strength; Low temperature cure/hardening