Innovative adhesive bonding of load-bearing wood materials at low temperature
- Nachwachsende Rohstoffe und neue Technologien
Abstract
Adhesive bonding is the key to advanced wood composites and structures. Within the present project, new and more efficient, energy-saving low-temperature approaches to the adhesive bonding of solid wood shall be developed. In detail, the chemical stability of adhesives in low-temperature environments will be characterised and the changes in curing characteristics will be monitored. The resulting adhesive films will be compared i terms of structure and mechanical properties with systems cured at standard temperature. Finally, the penetration behaviour of adhesives at low temperature will be investigated. The overall aim is to evaluate the competitiveness of low-temperature adhesive bonds with standard bonds in parallel with a thorough understanding of underlying mechanisms.
Publikationen
Low Temperature Adhesive Bonding for Structural Wood Materials
Autoren: Tran, A; Mayr, M; Konnerth, J; Gindl-Altmutter, W Jahr: 2020
PUBLIZIERTER Beitrag für wissenschaftliche Veranstaltung
Externe Links und Eigenschaften der Publikation:
Mitarbeiter*innen
Wolfgang Gindl-Altmutter
Univ.Prof. Dipl.-Ing.Dr.nat.techn. Wolfgang Gindl-Altmutter
wolfgang.gindl@boku.ac.at
Tel: +43 1 47654-89111
Project Leader
01.01.2018 - 31.12.2021
Anita Tran
Dr.nat.techn. Anita Tran M.Sc.
anita.tran@boku.ac.at
Tel: +43 1 47654-89160
Project Staff
04.02.2019 - 31.12.2021
Stefan Veigel
Dipl.-Ing.Dr. Stefan Veigel
stefan.veigel@boku.ac.at
Tel: +43 1 47654-89124
Project Staff
01.01.2018 - 31.12.2021
BOKU Partner
Externe Partner
Doka Industrie GmbH
partner