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Journal articles

Temperature-related tensile modulus of polymer-based adhesive films

Kumpenza C, Pramreiter M, Nenning TJ, Bliem P, Reiterer R, Konnerth J, et al. Temperature-related tensile modulus of polymer-based adhesive films. Journal of Adhesion [Internet]. 2023;99. doi:10.1080/00218464.2021.2011239
external links and characteristics of the publication:
SCI publication. Link to the Web of Science entry of the publication
DOI link to the document
SCOPUS publication. Link to the SCOPUS entry of the publication

BOKU Autors

Portrait Maximilian Pramreiter

Maximilian Pramreiter

Dipl.-Ing.Dr. Maximilian Pramreiter B.Sc.

Portrait Peter Bliem

Peter Bliem

Dipl.-Ing.Dr. Peter Bliem

Portrait Ulrich Müller

Ulrich Müller

Priv.Doz.Dr. Ulrich Müller

Portrait Cedou Kumpenza

Cedou Kumpenza

Cedou Kumpenza M.Sc.

Portrait Tobias Nenning

Tobias Nenning

Dipl.-Ing. Tobias Nenning

Portrait Johannes Konnerth

Johannes Konnerth

Univ.Prof. Dipl.-Ing.Dr. Johannes Konnerth

BOKU Organisations