Journal articles
The interphase in wood-adhesive bond lines by nanoindentation
Konnerth J. The interphase in wood-adhesive bond lines by nanoindentation. Holzforschung. 2006;60(4):429-33. doi:https://doi.org/10.1515/HF.2006.067
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BOKU Autors
Wolfgang Gindl-Altmutter
Univ.Prof. Dipl.-Ing. Dr.nat.techn. Wolfgang Gindl-Altmutter
Johannes Konnerth
Univ.Prof. Dipl.-Ing. Dr. Johannes Konnerth