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Conference & Workshop proceedings, paper, abstract

Thermal conductivity of hollow chamber sandwich boards

Vay, O, Hansmann, C, Teischinger, A, et al. Thermal conductivity of hollow chamber sandwich boards. In: Fachhochschule S, Studiengang H , editors. Processing Technologies for the Forest and Biobased Products Industries, book of abstracts. 2014.
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BOKU Autors

Portrait Oliver Vay

Oliver Vay

Dipl.Holzw. Dr. Oliver Vay

Portrait Ulrich Müller

Ulrich Müller

Priv.Doz.Dr. Ulrich Müller

Portrait Alfred Teischinger

Alfred Teischinger

Univ.-Prof. i.R. Dipl.-Ing. Dr.nat.techn. Dr.h.c. Alfred Teischinger

Portrait Christian Hansmann

Christian Hansmann

Dipl.-Ing.Dr. Christian Hansmann